- LAM machine : After installing the Heater Pad, the MTBC (Mean Time Between Clean) of Transfer Module is extended from 2 weeks to 6 weeks.
- By using an external heater for the cavity, the vacuum pumping time can be shortened, improving equipment uptime and increasing production capacity.
- Using carbon fiber as the heating material can improve the thermal reaction speed and cleanliness.
01.Process/Chamber
Heater Pad Assembly
It is mainly used for moisture removal. It uses non-flammable silicone material to attach the designed heating plate and insulation cotton device to the outer surface of the chamber, so that the water vapor attached to the inner wall of the chamber evaporates and the vacuum degree of the machine reaches the process requirements.
Features
Product Applications and Specifications
Product Application
- It is widely used to eliminate moisture buildup in chamber such as Wafer Transfer Module, Air Lock, and Cooling Station.
- Installation Achievements : Applied Centris Sym3, TEL, LAM : Kiyo CX, Kiyo EX, Metal L, Flex… and other etching equipment.
| Max. Operating Temperatures |
Voltage | Max. Watt Densities |
Integrated Sensor/ Controller (optional) |
Material | Certification |
|---|---|---|---|---|---|
| 180°C | 110V ~ 230V | Custom (Configurable upon request) |
Type K TC Pt100 Thermostat PID Controller |
Silicone Rubber | SEMI S2 |
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