- Utilizing high thermal conductivity material (AlN), it achieves excellent thermal uniformity and a wide operating temperature range.
- The resistance heating element and RF electrode are co-sintered with AlN ceramic, and the ceramic shaft is directly bonded to the heating plate to achieve a compact integrated design.
- High corrosion resistance : It has excellent corrosion resistance to halogen gases and oxidizing environments.
- High surface flatness : ensures consistent thermal contact between wafers.
01.Process/Chamber
AlN Heaters / Hot Plate
AlN Heaters / Hot Plate are high-efficiency heating elements that use highly thermally conductive aluminum nitride (AlN) as a substrate and achieve heating through metal film deposition or printing electrodes. These heaters possess excellent thermal conductivity, electrical insulation, and high-temperature stability, making them suitable for applications requiring rapid heating and high cleanliness, particularly in industries such as semiconductors, optoelectronics, and precision equipment.
Features
Product Applications and Specifications
Product Application
- Wafer heating (pre-bake/post-bake)、CVD、ALD、Etch and other internal heating elements for cavity heating.
- TFT/LCD/AMOLED Heating platform.
- Microfluidic platform, thermal analysis module, thermal homogenization platform.
- Optoelectronic packaging : High-stability, high-insulation heating stage or pressure welding mold base.
| Max. Operating Temperatures |
Voltage | Power Range | Integrated Sensor Controller (optional) |
Material |
|---|---|---|---|---|
| > 250°C Custom |
48V、110V、230V | 100W ~ 1000W Custom |
Type K TC | AlN |
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