- The heater surface is anodized to reduce the generation of metal micro-pressure particles.
- Aluminum alloys have high thermal conductivity and excellent temperature uniformity of the heating surface.
- The body adopts a diffusion bonding method, which increases its service life.
- Improve the tolerance of traditional welding to alternating stress.
- It can be designed into various shapes according to customer needs.
01.Process/Chamber
Metal Pedestal Heaters
The main body is made of 6061 aluminum alloy and adopts metal diffusion bonding technology, which improves the shortcomings of the weld seam of the previous welding method, which is prone to cracking, and increases the service life of the heater.
Features
Product Applications and Specifications
Product Application
- Direct heating of semiconductor wafers. Real application : ASM Eagle XP.
- Heating of the glass substrate.
- Other planar carrier plate heating requirements.
| Max. Operating Temperatures |
Voltage | Max. Watt Densities |
Integrated Sensor/ Controller (optional) |
Material |
|---|---|---|---|---|
| 350°C | 208V ~ 230V | Custom (Configurable upon request) |
Type K TC | Aluminum Alloy |
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